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Etching Equipment Product List and Ranking from 5 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

Etching Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. 山縣機械 Osaka//Industrial Machinery ＦＴＰ事業部
  2. サムコ Kyoto//Industrial Machinery
  3. SETO ENGINEERING Ibaraki//Industrial Machinery 守谷事業所
  4. 4 明昌機工 Hyogo//Manufacturing and processing contract
  5. 4 ダン科学 Tokyo//Electronic Components and Semiconductors
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Etching Equipment Product ranking

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. Etching device "YCE-500WA" 山縣機械 ＦＴＰ事業部
  2. Dry etching equipment / XeF2 etching equipment サムコ
  3. Etching device "MS-3030LWE" 明昌機工
  4. Etching device SETO ENGINEERING 守谷事業所
  5. 4 Etching device (1) SETO ENGINEERING 守谷事業所

Etching Equipment Product List

1～7 item / All 7 items

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Etching device "YCE-500WA"

Etching device "YCE-500WA"

Our unique nozzle arrangement and oscillation mechanism enable high-precision etching without unevenness!

The "YCE-500WA" is an etching machine that allows for high-precision etching with the push of a button. The main body and other parts are made from completely corrosion-resistant materials that can withstand both acid and alkaline etchants. Additionally, it features large inspection windows and sturdy pressure valves to ensure safety during operation. 【Features】 ■ Fully automatic processing from preparation to etching and rinsing with the push of a button ■ With the all-day timer (optional), etching can be started immediately every morning ■ The use of a digital temperature controller and liquid circulation pump ensures uniform and constant liquid temperature control ■ Conveyor speed is accurately controlled with digital display ■ Built-in safety protection devices for liquid shortage, water shortage, and abnormal overheating *For more details, please download the PDF or feel free to contact us.

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Etching device "MS-3030LWE"

Etching device "MS-3030LWE"

Formation of localized etching areas! High-precision shape creation through scanning.

The "MS-3030LWE" is a numerically controlled local wet etching device that can create arbitrary shapes by scanning a locally controlled liquid phase etching area with speed control. Since it is a non-contact chemical distortion-free processing method, it is insensitive to disturbances such as vibrations. The processing amount can be accurately controlled with nanometer-order precision based on the etchant's residence time and temperature, allowing for the creation of arbitrary shapes. [Features] - Non-contact processing - Chemical distortion-free processing - Nanometer-order processing precision - Creation of arbitrary shapes through 5-axis NC control *For more details, please refer to the catalog or feel free to contact us.

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Dry etching equipment / XeF2 etching equipment

Dry etching equipment / XeF2 etching equipment

XeF2 etching device

● Since it is a completely dry process, it is possible to suppress the destruction of self-supporting devices due to stiction. ● No pre-treatment or post-treatment is required in the wet process. ● By intermittently flowing gas and etching, it is easy to control the etching speed and gas usage. ● Since it does not use plasma, there is no damage to the device from electric fields (electron or ion impact). ● Designed for research and development purposes, it is very compact and tabletop in design. ● As it is a dedicated machine, it is low-cost.

  • Etching Equipment

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Etching device

Etching device

Etching device

Device for etching copper foil after development using ferric chloride and cupric chloride 【Features】 ○ Lane configuration: 2 Lane ○ Transport speed: 2.0m/min ○ Material width: 35mm to 160mm for TAB/CSP/COF (250mm to 300mm for FPC) ○ Material thickness: PI 25μm and above ○ Processing surface: Single side ○ Device configuration: Unwinding → Etching → Rinsing → Liquid removal → Drying → Winding ○ Utilities: - Power supply: AC200V・220V / 50Hz・60Hz - Tap water, pure water, cooling water, scrubber, heat exhaust, (steam) ○ Device dimensions: 16m (L) × 2.5m (W) × 2.5m (H) ● For other functions and details, please contact us.

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Etching device (1)

Etching device (1)

The transport speed is 5.0 m/min, and it can accommodate material widths up to 310 mm! Etching the surface of metal foils (such as aluminum).

The device is used for etching the surface of metal foils (such as aluminum). The transport speed is 5.0 m/min, and it can accommodate material widths of up to 310 mm. The device consists of a configuration of unwinding, etching processing, cleaning, drying, and winding. Using our low-tension transport technology, we can continuously process very thin and extremely fragile materials without causing scratches or wrinkles. 【Specifications】 ■ Lane configuration: 1 Lane ■ Material thickness: 20 μm and above ■ Processing surface: Single-sided and double-sided ■ Utilities: Power supply (AC 200/220V / 50/60Hz), pure water, tap water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 15 m (L) × 2 m (W) × 2.5 m (H) *Excluding control panel and ancillary equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Drying Equipment
  • Other surface treatment equipment
  • Etching Equipment

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Etching device (2)

Etching device (2)

The transport speed is 1.5m/min, and it can accommodate material widths up to 350mm! The chemical temperature and pressure are controlled with high precision.

The device continuously performs etching on thin single-layer substrates such as FPC using a roll-to-roll transport method. The device consists of the following processes: unwinding (substrate loading) → laminating → etching → rinsing → acid washing → rinsing → winding (substrate peeling) → rinsing → drying → substrate stacking. In addition to the transport mechanism, the temperature and pressure of the chemical solutions are precisely controlled. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 1.5 m/min ■ Material width: MAX 350 mm ■ Material thickness: 50 μm and above ■ Processing surface: single side *For more details, please refer to the PDF document or feel free to contact us.

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GaAs etching equipment

GaAs etching equipment

Automatically mixes the chemical solution and delivers the required amount to the etching tank! It employs a sequencer control method.

The product is a device that automatically transports and etches GaAs wafers using a dedicated basket. When GaAs wafers placed in the basket from the loader section are introduced, they are automatically transported by a conveyor from the loader section to the etching tank, rinse tank, and unloader section. Additionally, there is a chemical supply tank located at the bottom of the device, which automatically mixes the chemicals and supplies the necessary amount to the etching tank. 【Main Specifications】 ■ Heated material: GaAs (Gallium Arsenide) block ■ Cassette: Dedicated PTFE cassette ■ Conveyor: Automatic robot transport (servo motor driven) ■ Control method: Sequencer control *For more details, please refer to the PDF document or feel free to contact us.

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